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Improved Power Management Components For Robust Performance

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Not only the system efficiency is increased in high-power density designs but superior thermal operation is also achieved

Increased importance of power conservation calls for a need to monitor the growing electricity consumption, especially in applications such as e-scooters, e-forklifts and other light electric vehicles (LEVs), as well as, power tools and battery management systems that demand high current rating, ruggedness and extended lifetime.

To address this requirement by offering more choices to power system designers for meeting diverse design needs and achieve maximum performance in the smallest space, Infineon Technologies AG now offers two new OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). With the innovative TO-Leadless (TOLL) package, the TOLx family offers very low RDS(on) and a high-current rating over 300 A that increases system efficiency in high-power density designs.

The TOLG package combines the best features of TOLL and D2PAK 7-pin packages, sharing the same 10 x 11 mm2 footprint and electrical performances as TOLL with added flexibility comparable to D2PAK 7-pin. The main advantages of TOLG are particularly apparent in designs with aluminium-insulated metal substrate (Al-IMS) boards. In these designs, the coefficient of thermal expansion (CTE), which describes the tendency of a material to change its shape in response to temperature variations is higher than copper-IMS and FR4 boards.

Over time, temperature cycling on board (TCoB) produces a crack in the solder joint between the package and the PCB. With the flexibility of the gullwing leads, TOLG demonstrates excellent solder joint robustness, significantly increasing product reliability in applications where repetitive temperature cycling takes place. The new package achieves two times higher TCoB performance compared to the IPC-9701 standard requirement.

The TOLT package is optimised for superior thermal operation. Constructed with its lead-frame flipped to position exposed metal on the top side, the package contains multiple gullwing leads on each side for high current carrying drain and source connections. A flipped lead-frame allows the heat to pass from the exposed metal topside – through the insulating material and directly into the heatsink. Compared to the TOLL bottom-side cooling package, the TOLT improves RthJA and RthJC by 20 per cent and 50 per cent, respectively. These specifications enable a lower bill of material cost, particularly for the heatsink. Additionally, OptiMOS in TOLT reduces PCB space as components can now be mounted on the bottom of the MOSFET.

The OptiMOS TOLx family will be available across a wide range of voltage classes in OptiMOS 3 and 5 technology. TOLG will be available in the Q4 of 2021 from 60 V to 250 V in a broad product portfolio, including best-in-class and price/performance-optimised products. TOLT is currently available in 80 V and 100 V voltage classes. An evaluation power board is also available, featuring a 100 V OptiMOS 5 power MOSFET in a TOLG package (IPTG014N10M5).




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